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Home Highcon Highcon Euclid IIIC for Corrugated Wins Big at FESPA

Highcon Euclid IIIC for Corrugated Wins Big at FESPA

on: May 22, 2018In: Highcon
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Highcon Systems will showcase its new Euclid IIIC digital cutting and creasing machine at FESPA in Berlin. The device was awarded the “Best digital sheetfed cutting solution” in the Annual Awards from the European Digital Press Association (EDP) for quality and innovation in technologies for the digital printing industry.

The post Highcon Euclid IIIC for Corrugated Wins Big at FESPA appeared first on Package Printing.

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Tags: ConsumablesConsumables-Substrates - Corrugated BoardEuclid IIICFespaFinishing - Digitalprinting
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