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Home Print News Somic to Introduce Unique, Multi-Component Packaging Machine at PACK Expo

Somic to Introduce Unique, Multi-Component Packaging Machine at PACK Expo

on: July 27, 2018In: Print News
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Eagan, Minn. – Somic America, Inc. (booth E-8550) will unveil a revolutionary machine to the North American market at PACK Expo, October 14-17 in Chicago. The SOMIC-FLEX III represents a new concept that will give customers a true advantage in the marketplace with tremendous flexibility, outstanding speed and a host of other benefits. The patent-pending SOMIC-FLEX III addresses requests from retail chains in the North American market looking for upright, two-part cardboard packaging. A le

Source: WhatTheyThink.com Printing Industry News
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